ZB-S800 High-Precision 3D SPI Solder Paste Inspection Machine | Automated SMT Printing Quality Control System PCB Handling Machine effectively overcome board deformation and

effectively overcome board deformation and ensure uniform printing

The PCB with components is dipped into the solder tank through the mechanical arm equipment

The RF-B630T inline reflow oven is configured with 6 heating zones followed by cooling section(s)

with offline programming (OLP) to save setup time

and with improved mechanical components and an optimized design

ZB-S800 High-Precision 3D SPI Solder Paste Inspection Machine | Automated SMT Printing Quality Control System PCB Handling Machine effectively overcome board deformation andAdvanced 3D Solder Paste Inspection for Accurate Volume, Height, and Offset Measurement Improve Yield and Reduce Defects The 3D SPI Solder Paste Inspection Machine ZB S800 is an advanced inline inspection system designed to accurately measure solder paste volume, height, and position on PCBs. Using Phase Measuring Profilometry(PMP) imaging technology and high resolution cameras, it helps you identify and eliminate printing defects early by inspecting